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STPS2L25
Low drop power Schottky rectifier
Main product characteristics
A
IF(AV) VRRM Tj (max) VF(max) 2A 25 V 150 C 0.375 V
K
SMB STPS2L25U
Features and benefits

Very low forward voltage drop for less power dissipation Optimized conduction/reverse losses trade-off which means the highest efficiency in the applications Avalanche capability specified
A
K
SMB flat STPS2L25UF
Description
Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMB, SMB flat for thermal resistance characteristic improvement, this device is especially intended for use in parallel with MOSFETs in synchronous rectification. Table 1.
Symbol VRRM IF(AV) IFSM PARM Tstg Tj
1.
dPtot --------------dTj
Absolute ratings (limiting values)
Parameter Repetitive peak reverse voltage Average forward current SMB SMB flat TL = 125 C = 0.5 TL = 135 C = 0.5 tp = 10 ms sinusoidal tp = 1 s Tj = 25 C Value 25 2 75 1500 -65 to + 150 150 Unit V A A W C C
Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature(1)
1 ------------------------Rth ( j - a )
<
condition to avoid thermal runaway for a diode on its own heatsink
February 2007
Rev 5
1/9
www.st.com 9
Characteristics
STPS2L25
1
Table 2.
Symbol Rth(j-l)
Characteristics
Thermal resistance
Parameter SMB Junction to lead SMB flat 15 Value 25 C/W Unit
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test Conditions
Tj = 25 C Tj = 125 C Tj = 25 C
Min.
Typ.
Max. 90
Unit A mA
VR = VRRM
15
30 0.45
VF(1)
Forward voltage drop
Tj = 125 C Tj = 25 C Tj = 125 C
IF = 2 A
0.325
0.375 V 0.53
IF = 4 A
0.43
0.51
1. Pulse test: tp = 380 s, < 2%
To evaluate the maximum conduction losses, use the following equation: P = 0.24 x IF(AV) + 0.068 IF2(RMS)
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STPS2L25
Characteristics
Figure 1.
Average forward power dissipation Figure 2. versus average forward current
IF(AV)(A)
2.2
Average forward current versus ambient temperature ( = 0.5) SMB
PF(AV)(W)
1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 1.0 0.8 0.6
= 0.05
= 0.1
= 0.2
= 0.5
Rth(j-a)=Rth(j-l)
SMB
2.0 1.8 1.6
Rth(j-a)=100C/W
=1
1.4 1.2
T
0.4
T
IF(AV)(A)
=tp/T
2.0 2.2
0.2
tp
0.0 2.4 2.6 0
=tp/T
25
tp
50
Tamb(C)
75 100 125 150
Figure 3.
Average forward current versus ambient temperature ( = 0.5) SMB flat
Figure 4.
Non repetitive surge peak forward current versus overload duration (maximum values) SMB
IF(AV)(A)
2.2
Rth(j-a)=Rth(j-l)
IM(A)
10
SMB
2.0 1.8 1.6
Rth(j-a)=100C/W SMB flat
9 8 7 6
Ta=25C
1.4 1.2
5 1.0 0.8 0.6 0.4 0.2 0.0 0 4 3
Ta=75C
T
Ta=125C
2
IM t
=tp/T
25
tp
50
Tamb(C)
75 100 125 150
1 0 1.E-03
=0.5
t(s)
1.E-02 1.E-01 1.E+00
Figure 5.
Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat
Figure 6.
Normalized avalanche power derating versus pulse duration
IM(A)
30
SMB flat
PARM(tp) PARM(1s)
1
25
20
0.1
TL=25C
15
TL=75C
10
TL=125C
0.01
IM t
5
=0.5
t(s)
1.E-02 1.E-01 1.E+00
0.001 0.01 0.1 1
tp(s)
10 100 1000
0 1.E-03
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Characteristics
STPS2L25
Figure 7.
Normalized avalanche power derating versus junction temperature
Figure 8.
Relative variation of thermal impedance junction to ambient versus pulse duration - SMB
PARM(tp) PARM(25C)
1.2 1
Zth(j-a)/Rth(j-a)
1.0
SMB
0.9 0.8 0.7
0.8 0.6 0.4 0.2
0.6 0.5 0.4 0.3 0.2
T
Single pulse
Tj(C)
0 25 50 75 100 125 150
0.1 0.0
tp(s)
1.E-01 1.E+00 1.E+01
=tp/T
1.E+02
tp
1.E+03
1.E-02
Figure 9.
Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat
Figure 10. Reverse leakage current versus reverse voltage applied (typical values)
IR(mA)
1.E+02
Tj=150C
Zth(j-l)/Rth(j-l)
1.0
SMB flat
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
1.E+01
Tj=125C
Tj=100C
1.E+00
1.E-01
1.E-02
Tj=25C
tp(s)
1.E-03 0 5 10
VR(V)
15 20 25
Figure 11. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
Figure 12. Forward voltage drop versus forward current (typical values)
IFM(A)
10.0
Tj=125C
Tj=150C Tj=25C
100
1.0
VR(V)
10 1 10 100 0.1 0.0 0.1 0.2 0.3
VFM(V)
0.4 0.5 0.6
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STPS2L25
Characteristics
Figure 13. Forward voltage drop versus forward current (maximum values, high level)
10.0
Figure 14. Forward voltage drop versus forward current (maximum values, low level)
3.0
IFM(A)
IFM(A)
2.5
Tj=125 C (maximum values)
2.0
Tj=125 C (maximum values)
1.0
Tj=125 C (typical values)
1.5
Tj=125 C (typical values) Tj=25 C (maximum values)
Tj=25 C (maximum values)
1.0
0.5
VFM(V)
0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
VFM(V)
0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35m)
Rth(j-a)(C/W)
110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB flat SMB
SCU(Cm)
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Package information
STPS2L25
2
Package information
Epoxy meets UL94, V0 SMB dimensions
Dimensions Ref.
E1
Table 4.
Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059
D
A1 A2 b
1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
E
c
A1
E E1
b
C L
A2
D L
Figure 16. SMB footprint (dimensions in mm)
1.62 2.60 1.62
2.18
5.84
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STPS2L25 Table 5. SMB Flat dimensions
Package information
Dimensions Ref.
A c D L L2 E E1 L L1 b
Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029
Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024
A b(1) c
(1)
0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60
1.10 2.20 0.40 3.95 5.60 4.60 1.50
D E E1 L L1 L2
1. Applies to plated leads
Figure 17. SMB Flat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
1.20
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Ordering information
STPS2L25
3
Ordering information
Ordering type STPS2L25U STPS2L25UF Marking G23 FG23 Package SMB SMB flat Weight 0.107 g 0.50 g Base qty 2500 5000 Delivery mode Tape and reel Tape and reel
4
Revision history
Date July 2003 08-Feb-2007 Revision 4A 5 Last update Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Changes
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STPS2L25
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